CEESI Module Details

Module Title	Design for Thermal Issues
Providing Institution	University of Bolton
Credits	15 credits at level M
Length and Delivery Mode	Internet based distance learning over 14 weeks
Synopsis	Modern circuits operate at ever-higher frequencies and dissipate an increasing amount of heat, whilst end-user pressures are demanding smaller enclosures. Consequently most design and electronic packaging engineers now need to take thermal issues into account in order to ensure that their products will meet the required performance and reliability, and will not fail either functionally at temperature extremes, or prematurely during operation, simply because they have overheated. This module places emphasis on understanding the fundamental issues of heat transfer that lie behind recommended good practice, and on modelling the thermal aspects of a design as a means of ensuring reliable operation at affordable cost. It explores the issues progressively, first at component level, then at board level and finally at system level, concentrating on the application of analysis methods and simulation tools and on generating practical solutions.
Link to full specification	www.ami.ac.uk/courses/view_module.asp?code=ami4817
Frequency of delivery	every 8 months
Fee	£480
Contact for booking	Postgraduate Electronics Programmes Office University of Bolton Deane Road Bolton BL3 5AB email:ami@bolton.ac.uk tel:01204-903555 fax:01204-903088

Module Title	Microsystems Technologies
Providing Institution	University of Bolton
Credits	15 credits at level M
Length and Delivery Mode	Internet based distance learning over 14 weeks
Synopsis	This module introduces the technologies, production methods and application areas of Micro Electro-Mechanical Systems (MEMS). Basic design issues are discussed and the differences between processing for MEMS and processing for microelectronics are described. Mechanical, thermal, magnetic, chemical and biological MEMS are covered, each illustrated by examples of their applications.
Link to full specification	www.ami.ac.uk/courses/view_module.asp?code=ami4225
Frequency of delivery	twice a year
Fee	£480
Contact for booking	Postgraduate Electronics Programmes Office University of Bolton Deane Road Bolton BL3 5AB email:ami@bolton.ac.uk tel:01204-903555 fax:01204-903088

Module Title	Semiconductor Design for Testability
Providing Institution	Institute for System Level Integration (ISLI)
Credits	15 credits at level M
Length and Delivery Mode	Online distance learning using the "Blackboard" e-learning portal housed on the ISLI server.
Synopsis	The aim of this module is to introduce Design for Test concepts in relation to semiconductor devices and ICs. Emerging design practices and standards are reviewed. On completion of the module, the student will understand the constraints and motivations behind DfT integration and possess the knowledge to participate In a DfT integration project in both the digital and mixed signal domains.
Link to full specification	www.sli-institute.ac.uk
Frequency of delivery	January, May and September
Fee	£1,200
Contact for booking	Distance Learning Administrator Institute for System Level Integration Alba Centre Alba Campus Livingston Scotland EH54 7EG, UK Tel. +44 (0)1506 469 300 or (0)1506 469 322 Fax.+44 (0)1506 469 301 Email: courses@sli-institute.ac.uk