CEESI Module Details
SIGNAL INTEGRITY
| Module Title |
Signal Integrity & EMC |
| Providing Institution |
University of Bolton |
| Credits |
15 credits at level M |
| Length and Delivery Mode |
Internet based distance learning over 14
weeks |
| Synopsis |
Signal Integrity is a key issue in
the design of electronic based products and in particular printed
circuit boards (PCBs). As digital circuits operate at higher and higher
clock speeds, signal integrity becomes increasingly more important.
The PCB can dramatically alter the performance of circuits and it
should be considered as a major component that impacts on the design
activity at an early stage.
Compliance with European Directives for products that are to be used
in the European Community is a legal requirement and should be taken
into account in the design phase of a product. The Electromagnetic
Compatibilty Directive (EMC) is of particular importance in the design
of electronic based products. Signal integrity and EMC are interrelated
and this module covers both topic areas.
The syllabus includes: regulatory compliance in the European Community, the CE mark,
EMC test methods, relevant electromagnetic field theory,
the impact of EMC & LVD on the product design phase, digital signal integrity and
finite element analysis.
|
| Link to full specification |
www.ami.ac.uk/courses/view_module.asp?code=ami4814 |
| Frequency of delivery |
every 8 months |
| Fee |
£480 |
| Contact for booking |
Postgraduate Electronics Programmes Office
University of Bolton
Deane Road
Bolton
BL3 5AB
email:ami@bolton.ac.uk
tel:01204-903555
fax:01204-903088 |
| Module Title |
Design for Signal Integrity |
| Providing Institution |
University of Bolton |
| Credits |
20 credits at level M |
| Length and Delivery Mode |
Internet based distance learning over 14
weeks |
| Synopsis |
The ever increasing complexity of
electronic products and the drive to achieve higher clock speeds in
digital systems are together placing increased demands on signal integrity.
It has become essential to take all aspects of signal integrity into
account during the design phase of a product, and this applies to
the PCB in particular.
This module covers the technical aspects of applying signal integrity
requirements and constraints during the design phase of a product’s
development and builds on the Signal Integrity and EMC module.
The syllabus includes: overview of signal integrity, i/o buffer information
specification (IBIS), ASICs, passive electronic components from a
signal integrity viewpoint, reflections on ideal transmission lines
with imperfect terminating components, and signal integrity of differential
electronic systems. |
| Link to full specification |
www.ami.ac.uk/courses/view_module.asp?code=ami4823 |
| Frequency of delivery |
every 8 months |
| Fee |
£480 |
| Contact for booking |
Postgraduate Electronics Programmes Office
University of Bolton
Deane Road
Bolton
BL3 5AB
email:ami@bolton.ac.uk
tel:01204-903555
fax:01204-903088 |
| |
